Power Package Combines Cooling and Isolation

A power device package combines isolation, cooling, and reduced EMI in a design that helps engineers build high-voltage systems with fewer components. Navitas Semiconductor has launched the UHV-TO-247-4-ISO, a new high-voltage package for silicon carbide (SiC) MOSFETs designed to simplify the development of high-power systems while improving thermal performance, isolation, and electromagnetic interference (EMI) characteristics. […]